SILICEOUS FILM-FORMING COMPOSITION, METHOD FOR PRODUCING SILICEOUS FILM AND ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a composition for forming a siliceous film having excellent low dielectric properties and sufficient mechanical strength and curable at a lower temperature and/or a shorter time than those of a conventional composition and capable of improving adhesion and electrical reliability. SOLUTION: The composition for forming the siliceous film comprises (a) a siloxane resin such as an alkoxysilane, (b) a solvent such as an alcohol capable of dissolving the siloxane resin and (c) a polymer having hydroxy groups in the side chain so as to satisfy the relationship represented by formula (2) 0-2(2) (wherein, MOH denotes the concentration (mol/g) of hydroxy groups in the polymer) and (d) an ammonium salt, etc. COPYRIGHT: (C)2003,JPO