| 发明名称 |
SILICONE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED RESIN |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicone resin composition which has low melt viscosity, good dispersibility with an organic resin and good reactivity therewith, to provide a curable resin composition which has good moldability, forms a cured resin excellent in flame retardancy and has little adverse effect on the human body and the environment since it contains neither a halogenated epoxy resin nor antimony oxide. SOLUTION: The silicone resin composition comprises (A) a silicone resin represented by the average unit formula: (R<SP>1</SP>SiO<SB>3/2</SB>)<SB>a</SB>(R<SP>2</SP><SB>2</SB>SiO<SB>2/2</SB>)<SB>b</SB>(R<SP>3</SP><SB>3</SB>SiO<SB>1/2</SB>)<SB>c</SB>(SiO<SB>4/2</SB>)<SB>d</SB>(XO<SB>1/2</SB>)<SB>e</SB>and having a softening point above 25°C, and (B) a silicone resin that is liquid at 25°C. The curable resin composition comprises (I) a curable resin, (II) the silicone resin (A), and (III) the silicone resin (B). The cured resin is obtained by curing the curable resin composition. COPYRIGHT: (C)2003,JPO
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| 申请公布号 |
JP2003253122(A) |
申请公布日期 |
2003.09.10 |
| 申请号 |
JP20020054544 |
申请日期 |
2002.02.28 |
| 申请人 |
DOW CORNING TORAY SILICONE CO LTD |
发明人 |
MORITA YOSHIJI;UEKI HIROSHI;FURUKAWA HARUHIKO;NAKANISHI KOJI |
| 分类号 |
C08G77/14;C08K5/00;C08L61/06;C08L63/00;C08L83/04;C08L83/06;C08L101/00;(IPC1-7):C08L83/06 |
主分类号 |
C08G77/14 |
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