| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing of semiconductors having good molding properties, including good fluidity, hardenability and releasability, high reliability, especially high reliability with respect to high- temperature reflowing and high flame retardancy, and a semiconductor device using it. SOLUTION: The composition comprises (A) an epoxy resin, (B) a hardening agent, (C) an inorganic filler and (D) an organopolysiloxane, and (B) contains (b1) a phenol resin having repeated structural units of formula (I) (wherein R<SP>1</SP>s are each a hydrogen atom, a 1-4C lower alkyl group or a phenyl group; and they may be the same as or different from each other) and those of formula (II) (wherein R<SP>2</SP>s are each a hydrogen atom, a 1-4C lower alkyl group or a phenyl group; and they may be the same as or different from each other). COPYRIGHT: (C)2003,JPO
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