| 摘要 |
PROBLEM TO BE SOLVED: To provide a hardening agent for epoxy resins giving an epoxy resin composition which is useful for molding materials, diverse binders, coating agents and laminated materials, combines low water absorption, a low elastic modulus and low melt viscosity as a semiconductor-sealing material and has high soldering heat resistance and good hardening properties. SOLUTION: The agent consists of a thioester compound having two or more RC(O)S-groups, such as those of the formula: RC(O)SPh-PhSC(O)R (wherein R is a hydrocarbon group, and Ph is a phenylene group). The composition contains the agent. COPYRIGHT: (C)2003,JPO
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