HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a precursor which exhibits improved heat resistance in the form after ring closure where it is used while retaining processability by keeping solubility in an organic solvent and gives a heat-resistant resin excellent in electrical characteristics, physical characteristics and mechanical characteristics and suitable for uses such as an interlayer insulating film for a semiconductor, and to provide a heat-resistant resin, an insulating film and a semiconductor device. SOLUTION: The heat-resistant resin precursor comprises a polybenzoxazole resin precursor of a specific structure bearing a carboxylic acid group or a carboxylate group in the molecule. The polybenzoxazole resin is obtained from the polybenzoxazole resin precursor by a condensation reaction and/or a crosslinking reaction and a decomposition reaction. The insulating film comprises the polybenzoxazole resin. The semiconductor device has an interlayer insulating film for multilayer wiring or a surface-protecting film composed of the insulating film. COPYRIGHT: (C)2003,JPO