发明名称 |
HEAT SINK FOR SEMICONDUCTOR DIE EMPLOYING PHASE CHANGE COOLING |
摘要 |
<p>An electrical assembly, including an electrical device; and at least one self-contained phase change package in thermal contact with the electrical device, the self-contained phase change package including an enclosure and a phase change material arranged within the enclosure; wherein the phase change material is suitably selected to change phase during an overload condition.</p> |
申请公布号 |
AU2003212411(A1) |
申请公布日期 |
2003.09.09 |
申请号 |
AU20030212411 |
申请日期 |
2003.02.26 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
AJIT DUBHASHI |
分类号 |
H01L23/427;H05K1/02;H05K1/18 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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