Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates

摘要

An asymmetric double-sided substrate scrubber is provided. The asymmetric double-sided substrate scrubber includes a first roller and a second roller. The first roller is constructed from a first material having a first density and the second roller is constructed from a second material having a second density. The second density is designed to be greater than the first density. The first roller is designed to be applied onto a first side of a substrate with a first force and the second roller is designed to be applied onto a second side of the substrate with a second force. The second force is configured to be substantially equivalent to the first force.