发明名称 |
Reworkable and thermally conductive adhesive and use thereof |
摘要 |
Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader. |
申请公布号 |
US6617698(B2) |
申请公布日期 |
2003.09.09 |
申请号 |
US20010801655 |
申请日期 |
2001.03.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BUCHWALTER STEPHEN;GAYNES MICHAEL ANTHONY;LABIANCA NANCY C.;OGGIONI STEFANO SERGIO;TRAN SON K. |
分类号 |
C08G59/24;C08G59/42;H01L21/56;H01L21/58;H01L23/29;H01L29/06;(IPC1-7):H01L23/48 |
主分类号 |
C08G59/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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