发明名称 PLATE-SHAPED SILICON MANUFACTURING METHOD, SUBSTRATE FOR MANUFACTURING PLATE-SHAPED SILICON, PLATE-SHAPED SILICON, SOLAR CELL USING THE PLATE-SHAPED SILICON, AND SOLAR CELL MODULE
摘要 A plate-shaped silicon (11, 31) having a through hole (13A) and a cut-out portion (31B) without executing processings such as laser machining and machining is provided low cost so as to increase the demand for solar cells. Using the produced plate-shaped silicon (11, 31), a high-designability transparent (see-through) solar cell, a solar cell module, and an emitter wrap through solar cell are provided at low cost. A method for manufacturing a plate-shaped silicon by bringing a substrate into contact with a silicon melt and growing a crystal of plate-shaped silicon on the substrate is characterized by comprising a step of forming a through hole (13A) and/or a cut-out portion (31B) in the plate-shaped silicon (11, 31) while growing a crystal of a plate-shaped silicon on the substrate.
申请公布号 AU2003211282(A1) 申请公布日期 2003.09.09
申请号 AU20030211282 申请日期 2003.02.24
申请人 SHARP KABUSHIKI KAISHA 发明人 RYUICHI OISHI;YOSHIHIRO TSUKUDA
分类号 C30B19/00;C30B19/12;H01L31/042 主分类号 C30B19/00
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