发明名称 |
ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME |
摘要 |
There is disclosed an encapsulating epoxy resin composition, containing an epoxy resin (A), a curing agent (B), and a composite metal hydroxide (C), and having a disk flow greater than or equal to 80 mm. The resin composition is preferably applied for encapsulating a semiconductor device having at least one of features including: (a) at least one of an encapsulating material of an upper side of a semiconductor chip and an encapsulating material of a lower side of the semiconductor chip has a thickness less than or equal to 0.7 mm; (b) a pin count is greater than or equal to 80; (c) a wire length is greater than or equal to 2 mm; (d) a pad pitch on the semiconductor chip is less than or equal to 90 mum; (e) a thickness of a package, in which the semiconductor chip is disposed on a mounting substrate, is less than or equal to 2 mm; and (f) an area of the semiconductor chip is greater than or equal to 25 mm<SUP>2</SUP>. |
申请公布号 |
AU2003202139(A1) |
申请公布日期 |
2003.09.09 |
申请号 |
AU20030202139 |
申请日期 |
2003.01.14 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
RYOICHI IKEZAWA;TAKAYUKI AKIMOTO;YOSHIHIRO TAKAHASHI;MITSUO KATAYOSE |
分类号 |
C08K3/22;C08L63/00;H01L23/00;H01L23/29 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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