发明名称 Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof
摘要 A probing device for electrically contacting a plurality of electrodes aligned on an object to be tested so as to transfer electrical signal therewith. The probing device includes a wiring sheet formed by aligning a plurality of contact electrodes, corresponding to each of the electrodes on the object to be tested. Each of the contact electrodes is formed with a plurality of projecting probes on one surface of an insulator sheet with extension wiring electrically connected to each of the contact electrodes being formed on basis of a conductor thin film formed on either the one surface or an opposite surface the insulator sheet. Means also are provided for applying contacting pressure to the wiring sheet to obtain electrical conduction between the extension wiring and the object to be tested whereby contacting tips of the projecting contact probes formed on each of the contact electrodes contact and form an electrical connection with an electrode on the object to be tested.
申请公布号 US6617863(B1) 申请公布日期 2003.09.09
申请号 US19990285074 申请日期 1999.04.02
申请人 HITACHI, LTD. 发明人 KASUKABE SUSUMU;HASEBE AKIO
分类号 G01R31/26;G01R1/067;G01R1/073;G01R3/00;G01R31/28;H01L21/66;H05K3/40;(IPC1-7):G01R31/02 主分类号 G01R31/26
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