| 摘要 |
A hybrid wafer gyroscope includes a combination of micro-machined components and traditional electromechanical components to form a miniature gyroscope having a high degree of stability. The gyroscope includes a rotor, gimbal, flexures, and stop cutouts micro-machined out of one or more layers of silicon, forming a unitary, planar, and disk-shaped rotor subassembly, which spins about a drive shaft.
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