发明名称 Modular electronics enclosure
摘要 An electronics enclosure includes a mounting bracket adapted to mount to a support structure, a heat absorption module adapted to mount to the mounting bracket, and a housing to contain electronic equipment. The housing is adapted to mount alternatively to either the mounting bracket or the heat absorption module dependent upon solar loading conditions.
申请公布号 US6618250(B2) 申请公布日期 2003.09.09
申请号 US20010943391 申请日期 2001.08.30
申请人 ERICSSON INC. 发明人 NEALIS EDWIN JOHN
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
代理机构 代理人
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