| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bonding sheet for manufacturing a build-up printed wiring board which is excellent in the bonding power to plating copper, heat resistance, elastic modulus and reliability, by an additive method. SOLUTION: A sheet of a B-stage resin composition with a metal leaf containing a base material for an additive which has a composition wherein a layer c of a base material reinforced B-stage resin composition is stuck to a layer of a resin composition for the additive formed on the surface of the metal leaf a having surface indentations, is used. Moreover, a resin composition which contains, as a requisite component, a resin component prepared by compounding 15-500 pts.wt. of an epoxy resin (b) being a liquid at a room temperature with 100 pts.wt. of a multifunctional cyanic acid ester monomer and a cyanic acid ester prepolymer (a) and by compounding 0.005-10 pts.wt. of a thermosetting catalyst (c) with 100 pts.wt. of (a+b), as a resin hardly soluble in a roughening solution, and which is prepared by uniformly dispersing, in the resin composition, two or more out of three components, i.e., a resin soluble in the roughening solution, an organic powder d and an inorganic powder, is used at least as the resin composition for the additive of the B-stage resin composition containing the base material. COPYRIGHT: (C)2003,JPO |
