| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive sheet for producing a printed wiring board excellent in heat resistance, elasticity, and reliability by a lamination molding method. SOLUTION: A B-stage resin composition layer is adhered to both sides of a heat resistant film base material. As the B-stage resin composition, a curable resin composition containing a resin composition incorporated with 15-500 pts.wt. of an epoxy resin (b) liquid at room temperature per 100 pts.wt. of a multifunctional cyanate monomer and the cyanate prepolymer (a) and 0.005-10 pts.wt. of a heat-curing catalyst per 100 pts.wt. of (a+b) as an indispensable component is used. A multi-layer printed wiring board, which is high in adhesive force to copper, mechanical strength, etc., resistant to warpage and torsion, and excellent in heat resistance, z-directional migration resistance, etc., can be produced. COPYRIGHT: (C)2003,JPO |
