发明名称 |
SOG materials for spacer anodic bonding and method of preparing the same |
摘要 |
Disclosed herein is an SOG (Spin on Glass) material for spacer anodic bonding, which includes: 0.1~3 wt % of tetraethyl orthosilicate (TEOS); 0.1~5 wt % of methyl triethyl orthosilicate (MTEOS); 20~30 wt % of ethanol; 0.1~2 wt % of acetic acid solution containing alkali metal ions; and 0.1~10 wt % of water. The solid content of alkali metal elements in the acetic acid solution containing alkali metal ions is 5%~60%, and the pH value of the SOG material is 4~6.
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申请公布号 |
US6617264(B1) |
申请公布日期 |
2003.09.09 |
申请号 |
US20020237041 |
申请日期 |
2002.09.09 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HSIAO MING-CHUN;SU KAI-NUNG;LEE CHENG-CHUNG;LIN PANG;CHEN SAN-YUAN |
分类号 |
B81B7/02;C03C27/06;H01L21/312;H01L21/314;H01L21/316;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
B81B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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