发明名称 |
Methods of manufacturing semiconductor devices |
摘要 |
A planarization method includes forming a dummy pattern in a film over a substrate. The dummy pattern includes a plurality of concave and convex portions. A chemical-mechanical polishing process is applied to the film, with the dummy pattern providing planarization of enhanced uniformity in comparison with known techniques.
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申请公布号 |
US6617663(B2) |
申请公布日期 |
2003.09.09 |
申请号 |
US20020090484 |
申请日期 |
2002.03.01 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HORIE TOMOKAZU;SUGIYAMA SHINICHI |
分类号 |
H01L21/3105;H01L21/762;(IPC1-7):H01L29/00 |
主分类号 |
H01L21/3105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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