发明名称 LASER BEAM MACHINING METHOD AND DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method that enables a numerical aperture of a hole to be enhanced, and also to provide a laser beam machining device that facilitates implementation of this method. <P>SOLUTION: A workpiece 8 is prepared containing a base member and a coating layer formed on the surface of the base member, with the base member comprising a material harder to be etched by a laser beam than the coating layer. In the workpiece, a pulsed laser beam is made incident on the surface of the coating layer, in which a hole is formed so as to reach the base member by the energy of the laser beam. During the period of forming one hole, the pulse energy is increased with a lapse of time. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003251483(A) 申请公布日期 2003.09.09
申请号 JP20020053936 申请日期 2002.02.28
申请人 SUMITOMO HEAVY IND LTD 发明人 ISO KEIJI
分类号 B23K26/00;B23K26/38;B23K103/16;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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