发明名称 |
Method and apparatus for spin coating |
摘要 |
A rotatable cover plate assembly (10) has a cavity (13) and a rotatable base plate assembly (12) has a cavity (42) with a semiconductor wafer (14) mounted therein. The cover plate assembly (10) comes down onto the base plate assembly (12) enclosing the semiconductor wafer (14) and a dispenser (28) in a chamber formed by the cavities (13) and (42). The cover and base plates (16) and (40) are rotated as a single assembly, and coating material dispensed by the dispenser (28) onto the semiconductor wafer (14). A flow regulator (25) coupled via an exhaust manifold (20) controls the rate of evaporate of solvent from the dispensed coating material.
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申请公布号 |
US6616758(B2) |
申请公布日期 |
2003.09.09 |
申请号 |
US20010886523 |
申请日期 |
2001.06.20 |
申请人 |
TECHPOINT PACIFIC (S) PTE LTD |
发明人 |
HUNG CHING-CHANG ALEX;MAHNEKE LOTAR PETER;CHEN YING-YI |
分类号 |
H01L21/00;H01L21/687;(IPC1-7):B05C11/02 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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