发明名称 |
METHOD OF PROCESSING A SEMICONDUCTOR WAFER AND PREPROCESSED SEMICONDUCTOR WAFER |
摘要 |
A method of processing a semiconductor wafer (10) is provided. The method comprises the steps of: providing a semiconductor wafer (10) as a semiconductor substrate (12), preprocessing the semiconductor wafer (10) by depositing on the semiconductor wafer (10) at least one additional layer (14, 16), and further processing the preprocessed semiconductor wafer (10). The preprocessing is accomplished in a first factory (18) and the further processing is accomplished in a second factory (20). The present invention is further related to a preprocessed semiconductor wafer (10) an to a system for processing a semiconductor wafer (10). |
申请公布号 |
AU2002366439(A1) |
申请公布日期 |
2003.09.09 |
申请号 |
AU20020366439 |
申请日期 |
2002.09.27 |
申请人 |
MOTOROLA, INC. |
发明人 |
TIMOTHY, DARYL STANLEY;JOHN MALTABES;KARL MAUTZ |
分类号 |
H01L21/223;H01L21/336;H01L21/66;(IPC1-7):H01L21/00;H01L21/302 |
主分类号 |
H01L21/223 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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