| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer, a method of processing the same, and a method of manufacturing a semiconductor device, with which the production yield of the chips formed in the outermost region of the chip-forming region is kept high. SOLUTION: This method of processing a semiconductor wafer includes a step (A) of forming trench element isolation regions. The semiconductor wafer 10 comprises a chip region 20 and a non-chip region 22. In the step (A), dummy trench element isolation regions 40 are formed in at least a part of the non-chip region 22. The method of manufacturing a semiconductor device includes the method of processing a semiconductor wafer. COPYRIGHT: (C)2003,JPO
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