| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device, where it is possible to prevent a resin from flowing into the functional section of a circuit element even by relatively rough coating control while using sealing resin of relatively low viscosity and the improvement of working efficiency and quality is achieved. SOLUTION: The electronic device where the circuit element 10 having the functional section 12 and the electrodes 13 on a principal surface and a substrate 1 having electrode pads 2 are arranged facing with each other, and the electrodes 13 of the circuit element are electrically connected to the electrode pads 2 of a substrate by bumps 15. A frame-shaped step section 3 is fixed on the surface of the substrate 1 to provide a recess 4 smaller than the external shape of the circuit element 1 and larger than the functional section of the circuit element 1. Resin stop section 3a, which declines as it widens from the circuit element toward the substrate, is formed on the inner circumference of the step section 3, and the height of the bumps 15 is set such that a gapδ, into which the sealing resin of liquid form can infiltrate by capillary phenomenon, is formed between the principal surface of the circuit element 10 and the surface other than the concave section of the substrate 1. By filling the sealing resin between the principal surface of the circuit element and the surface other than the recess of the substrate, the space between the circuit element and the substrate is sealed. COPYRIGHT: (C)2003,JPO |
