| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat transfer device for an electronic component that cools or heats an electronic component, which is small, can obtain excellent heat dissipation effect and can reduce the number of wirings required for a substrate, etc. SOLUTION: The device has a heat transfer member abutting on an electronic component and a heat dissipating member, having conductivity, connecting to the heat transfer member. The dissipating member configures part of an electric circuit. COPYRIGHT: (C)2003,JPO |
