| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for manufacturing a bonding sheet for build-up printed-wiring boards having high plated copper bonding force and elasticity and superb heat resistance and reliability by an additive method. SOLUTION: A resin composition layer for additives, preferably metal foil or a separation film, is arranged on the side of a base reinforcement B-stage resin composition sheet for integration by laminate bonding, thus manufacturing a B-stage resin composition sheet containing a base for additives. COPYRIGHT: (C)2003,JPO |
