| 摘要 |
PROBLEM TO BE SOLVED: To provide a rigid flex printed wiring board capable of folded mounting in which packaging density of components is increased while enhancing heat dissipation by employing a multilayer circuit. SOLUTION: In the rigid flex printed wiring board consisting of a rigid part and a flexible part, a metal plate is pasted to at least one side of the flexible part through an insulating material. COPYRIGHT: (C)2003,JPO |
