| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer substrate which hardly causes defective bonding in manufacturing processes, and to provide a method of manufacturing the same. SOLUTION: The method of manufacturing the multilayer substrate 10 comprises processes of forming, in an insulation layer 1a formed with a conductor layer 6 on one principal plane, through-holes reaching the conductor layer 6 from the other principal plane of the insulation layer 1a, hollowing a face of the conductor layer 6 exposed in the through-holes with respect to an interface between the conductor layer 6 and the insulation layer 1a, forming metal bumps 4a on the hollowed face of the conductor layer 6, forming a conductor 3a for connection on the metal bumps 4a to fill in the through-holes, and removing the conductor layer 6 from the insulation layer 1a whose through-holes are filled with the conductor 3a for connection. COPYRIGHT: (C)2003,JPO |
