| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing flip-chip IC, by which solder paste can be printed on barrier metal layers in the prescribed pattern corresponding to a screen plate by effectively preventing the flow of the solder paste. SOLUTION: In this method of manufacturing flip-chip IC, a plurality of barrier metal layers 3 is formed on one main surface of a semiconductor substrate 1 and, at the same time, passivation layers 4 are formed in the regions of the main surface, in which the barrier metal layers 3 are not formed. Then solder bumps 5 are formed on the barrier metal layers 3, by applying solder paste 5' to the surfaces of the layers 3 using stencil printing. Higher than or equal to 95% volume of the solder component contained in the paste 5' is constituted of solder particles 5a, having particles diameters d larger than the difference h in thickness between the barrier metal layers 3 and the passivation layers 4 located in the vicinities of the layers 3. COPYRIGHT: (C)2003,JPO
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