发明名称 TREATMENT DEVICE BEFORE WAFER INSPECTION
摘要 PROBLEM TO BE SOLVED: To realize a treatment device before wafer inspection capable of improving analysis precision further by devising a drying means used in a treatment process before inspection. SOLUTION: In this treatment device before wafer inspection constituted in such a way that a naturally oxidized film formed on a surface of a silicon wafer 7 (8) is made to react to hydrofluoric acid steam or hydrofluoric acid solution to be dissolved, and liquid droplets S of the dissolved liquid collected in a predetermined section on the silicon wafer are dried by the drying means 9 to process into a dried trace for measuring and analyzing degree of pollution, the drying means 9 is provided with a light source part 15 incorporating a lamp 17 and a light introducing bar 25 extended from the light source part and having a light projection face at a tip. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003247921(A) 申请公布日期 2003.09.05
申请号 JP20020051557 申请日期 2002.02.27
申请人 NSE TEKKU KK;TECHNOS:KK 发明人 NAKAZAWA TAKAO;NISHIKATA YASUKATSU;ISHII TAKEYUKI;OTSUKI KAZUFUMI;IMAMURA TAKUMI
分类号 G01N1/28;G01N33/38;(IPC1-7):G01N1/28 主分类号 G01N1/28
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