| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating solution agitating method which ensures excellent film quality and via hole filling property to a having via holes and resist thereon with excellent reproducibility when performing electric plating on a printed circuit board. SOLUTION: When performing the electric plating of a circuit 4 such as a printed circuit board and a semi-conductor substrate, the plating solution 2 is agitated by ejecting or blowing the plating solution against wall surfaces or a bottom surface of a plating tank 1 to generate a reflection flow, inserting the 4 and an anode plate 3 in the reflection flow so as to be parallel to the direction of the reflection flows 9, 10 and 11. The plating of homogenons, uniform and excellent quality is performed thereby. COPYRIGHT: (C)2003,JPO
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