| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive polyimide resin precursor composition giving a transparent polyimide resin having heat resistance and to provide an optical device, particularly an optical waveguide formed of the resin. <P>SOLUTION: The photosensitive polyimide resin precursor composition comprises (a) a polyamic acid obtained from a tetracarboxylic acid dianhydride and a diamine, (b), 0.01 to <5 pts.wt. sensitizer comprising, a 1,4-dihydropyridine derivative, based on 100 pts.wt. of the polyamic acid, and (c) 5-50 pts.wt. glycol (ether) such as polyethylene glycol, polyethylene glycol dimethyl ether, polypropylene glycol or polypropylene glycol diphenyl ether. An optical polyimide resin comprising the composition is provided. In the light guide obtained by enveloping a core layer which becomes a resin wiring pattern in a clad, the core layer comprises the optical polyimide resin. <P>COPYRIGHT: (C)2003,JPO |
