| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition capable of forming a thick film, excellent in photosensitive characteristics, having high sensitivity, giving a pattern of a good shape even with small light exposure and ensuring a high residual film rate after development, excellent properties of a cured film and a low shrinkage percentage of a coating film after heat curing, to provide a method for producing a pattern capable of shortening a production process and capable of decreasing production cost and to provide electronic parts using the pattern. <P>SOLUTION: The photosensitive resin composition comprises (A) a polyimide precursor having a repeating unit represented by formula (I) (where X is a tetravalent aromatic ring-containing group; Y is a divalent aromatic ring- containing group; R<SP>1</SP>and R<SP>2</SP>are each H or a monovalent organic group; and at least one of X and Y has three or more aromatic ring), (B) an addition- polymerizable compound having ≥100°C boiling point under atmospheric pressure and (C) a photoinitiator. The method for producing a pattern uses the composition. <P>COPYRIGHT: (C)2003,JPO |
