| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which is small in size and sufficiently reliable without using underfil resin for storing an electronic component element. SOLUTION: An input electrode and an output electrode formed on the bottom face of the electronic component element are connected to the electrode pads on the bottom face of a cavity of a container via conductive bumps. A ground electrode formed on the top face of the electronic component element is connected to a sealing section of a shield case via conductive adhesive. The metal shield case is bonded to the outer surface of a side wall of the container, and a ground terminal section is extended to the bottom face of the container from the sealing section for sealing the opening of the cavity along the side face of the container. COPYRIGHT: (C)2003,JPO
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