发明名称 PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To effectively prevent an optical axis of a translucent member of a holding member from being deviated by bringing about an inclination by a brazing material, by adhering the brazing material flowed to a mount of the translucent member when the translucent member is connected to the holding member inserted into a through hole of a frame after a seal ring is connected to an upper surface of the frame. SOLUTION: A package for housing an optical semiconductor element comprises a base 1 for placing the optical semiconductor element 5, the frame 2 connected to an outer periphery of an upper main surface of the base 1 and having a through hole 2a formed at the side, the cylindrical holding member 3 holding the translucent member 3a and inserted into the hole 2a, and a plate- like translucent member 3a brazed at the outer periphery of one main surface to one end of the frame side of the member 3. In this package, a cutout 2b is formed from the upper surface of the frame 2 to the upper end of the hole 2a on the inner surface of the side formed with the hole 2a, and formed with a step to increase the width of the frame at the upper surface side as compared with the width of the hole 2a at the upper end side. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003248150(A) 申请公布日期 2003.09.05
申请号 JP20020047085 申请日期 2002.02.22
申请人 KYOCERA CORP 发明人 SUEMITSU TAIZO
分类号 G02B6/42;H01L23/04;H01L31/02;H01S5/022;(IPC1-7):G02B6/42 主分类号 G02B6/42
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