| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a gap being left between an electrode pad 4A and a bump electrode 15 of a wiring substrate 1 so that poor connection between them is generated, in a heat cycle test. SOLUTION: This electronic device comprises a semiconductor chip 10, which is fixed to the mounting surface of the wiring substrate 1 with a binding material in between, while an external terminal 13 is electrically connected to the electrode pad 4A of the wiring substrate 1 with the bump electrode 15 in between. A recessed part 4B is formed in the electrode pad 4A, and the electrode pad 4A is connected to the bump electrode 15 in the recessed part 4B. The electrode pad 4A is formed on a surface of a flexible layer 3, and the recessed part 4B is formed by elastic deformation of the electrode pad 4A and the flexible layer 3. COPYRIGHT: (C)2003,JPO |
