| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conducting structure which contains a thermal conductive filler, is excellent in thermal resistance and hardly causes bubbles in its interior. SOLUTION: In the structure, a thermal conductive material formed by making a thermal conductive composition react and solidify is provided in a gap between a heat generating element and a heat radiating body to conduct heat of the heat generating element. The thermal conductive composition is one in which a liquid resin composition is mixed with a thermal conductive filler. In this structure, the resin composition contains an acrylic resin, and exhibits the decrease in weight of 3% or low when it is heated at 100°C for ten minutes under a pressure of 1,013 hPa. COPYRIGHT: (C)2003,JPO
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