| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the loss of a high frequency signal becomes very large since a conduction pattern resonates when a ground wiring layer is positioned in a part facing the conduction pattern in a wiring board region with the miniaturization of a wiring board. SOLUTION: A plurality of wiring board regions divided by division grooves are vertically and laterally arranged and formed on a mother board. The ground wiring layers 7 and signal wiring are given to the wiring board regions. A plurality of wiring patterns 5 formed between the adjacent wiring board regions by crossing the division grooves 6 and conduction patterns 5 formed between the adjacent wiring patterns 2 by exceeding the division line 6 are disposed. The ground wiring layers 7 are not arranged in parts facing the conduction patterns 5 in the wiring board regions. Since the conduction pattern 5 does not resonate with respect to the high frequency signal with the ground wiring layer 7, the transmission loss of the high frequency signal transmitted through the wiring patterns for signal can be reduced to a minimum. COPYRIGHT: (C)2003,JPO
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