发明名称 MULTIPLE-PATTERN WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To secure the number of wiring boards and to simultaneously dispose shapes showing the directionality of the wiring boards with outline machining. SOLUTION: In the multiple-pattern wiring board, a plurality of wiring board regions 2 having wiring conductors 6 on surfaces are integrally arranged and formed in the center of a matrix board 1 formed of an insulating substrate in an almost square plane shape in vertical and lateral lines, and cut hem regions 3 are formed between the wiring board regions 2. The four wiring board regions 2 around the crossing of the lateral and vertical cut hem regions 3 are made into one group. A plurality of groups where the shapes of the wiring board regions 2 and the wiring conductors 6 are formed to overlap with the other wiring board regions 2 and wiring conductors 6 when they are rotated with the crossing as the center are adjacently arranged. A through hole 4 whose diameter is larger than the width of the cut hem region 3 is formed on the crossing by cutting a part of the wiring board region 2 on the crossing side. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249726(A) 申请公布日期 2003.09.05
申请号 JP20020050564 申请日期 2002.02.26
申请人 KYOCERA CORP 发明人 KATORI NAOHIRO
分类号 H05K1/02;H05K3/00;(IPC1-7):H05K1/02 主分类号 H05K1/02
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