| 发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING VARIABLE FREQUENCY TYPE PROBE TEST PAD AND SEMICONDUCTOR SYSTEM |
| 摘要 |
A semiconductor integrated circuit device including a variable frequency type probe test pad and a semiconductor system are disclosed. The semiconductor integrated circuit device includes a plurality of probe test pads formed on a semiconductor substrate and configured to induce non-contact electrical coupling with a probe card, and a frequency control unit electrically coupled to each of the plurality of probe test pads, and configured to vary a frequency of each of the plurality of probe test pads. |
| 申请公布号 |
US2016252572(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201514724430 |
申请日期 |
2015.05.28 |
| 申请人 |
SK hynix Inc. |
发明人 |
BAEK Seung Geun |
| 分类号 |
G01R31/315;G01R1/067;G01R31/302 |
主分类号 |
G01R31/315 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor integrated circuit device comprising:
a plurality of probe test pads formed on a semiconductor substrate and configured to induce non-contact electrical coupling with a probe card; and a frequency control unit electrically coupled to each of the plurality of probe test pads, and configured to vary a frequency of each of the plurality of probe test pads. |
| 地址 |
Icheon-si Gyeonggi-do KR |
