发明名称 PREPARING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for preparing a semiconductor device having satisfactory characteristics. SOLUTION: In the preparing method for a semiconductor device, a first amorphous semiconductor film where the concentration of oxygen is set to 7×10<SP>19</SP>cm<SP>-3</SP>or less is formed on an insulating board, the first amorphous semiconductor film is crystallized by heat treatment, and a second amorphous semiconductor film is formed by a magnetron type RF sputtering method using a single crystal silicon as a target under an atmosphere containing argon. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249450(A) 申请公布日期 2003.09.05
申请号 JP20020369763 申请日期 2002.12.20
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 C23C14/34;H01L21/20;H01L21/203;H01L21/336;H01L29/786;(IPC1-7):H01L21/203 主分类号 C23C14/34
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