| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating device which can reduce the load on a plating solution by reducing the volume of the plating solution which is adhered to a substrate holder and taken out of a plating tank. SOLUTION: In the plating device to perform the plating which has the substrate holder 18 to seal an outer peripheral part and a back side of the substrate in an airtight manner, expose a face side thereof and hold the substrate, and immerses the substrate holder 18 in the plating solution held in the plating tank (a plating unit 38), a cleaning device 410 is provided, which blows a fluid toward the substrate holder 18 above the plating tank (the plating unit 38) to clean off the plating solution stuck to the substrate holder 18, and returns the plating solution to the plating tank (the plating unit 38). COPYRIGHT: (C)2003,JPO
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