| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a sealant, which has excellent heat sealability and easy peelability and exhibits high sealing strength even at a low sealing temperature. SOLUTION: The resin composition for a sealant comprises 30-90 wt.% of an ethylene polymer (A) having a melt flow rate of 0.1-30 g/10 min, a density of 0.900-0.940 g/cm<SP>3</SP>, and a specified melt tension value, 5-60 wt.% of an ethylene/α-olefin random copolymer (B) having a melt flow rate of 0.5-50 g/10 min, a density of less than 0.900 g/cm<SP>3</SP>, and a melting point determined by differential scanning calorimetry (DSC) of below 80°C, and 5-30 wt.% of a butene-based polymer (C) having a melt flow rate of 0.1-25 g/10 min and a density of 0.880-0.925 g/cm<SP>3</SP>. A film obtained from the resin composition is suitable for the sealant layer of a packaging film. COPYRIGHT: (C)2003,JPO
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