发明名称 FLAME-RETARDANT THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATED BOARD FOR ELECTRICAL WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition which achieves UL94V-0 flame retardancy while containing a halogen and an antimony compound each in a content of 0.25 wt.% or less and which exhibits excellent Tg and heat resistance. SOLUTION: The thermosetting resin composition is characterized in that it is a thermosetting resin containing (A) 5-80 pts.wt. of an epoxy resin, (B) 0-80 pts.wt. of a compound having a dihydrobenzoxazine ring, and (C) 5-80 pts.wt. of a polycondensation product of a phenol, a compound having a triazine ring, and an aldehyde, with the sum of (A), (B) and (C) of 100 pts.wt. and that 5-80 pts.wt. of the epoxy resin is (D) an epoxy resin containing phosphorous. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003246844(A) 申请公布日期 2003.09.05
申请号 JP20020049845 申请日期 2002.02.26
申请人 HITACHI CHEM CO LTD 发明人 OHORI KENICHI;TAKEDA YOSHIYUKI;KAKIYA MINORU;ABE NORIHIRO
分类号 C08J5/24;B32B15/08;C08G59/30;C08G59/40;(IPC1-7):C08G59/40 主分类号 C08J5/24
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