| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing epoxy resin molding material having good flame resistance, without reducing moldability, nor reliability such as reflowing resistance and water-vapor resistance, even though no halogen nor antimony is contained therein, and to provide an electronic component unit equipped with elements sealed by using the molding material. SOLUTION: This sealing epoxy resin molding material comprises (A) an epoxy resin, (B) a hardening agent, and (C) acenaphthylene as essential ingredients. COPYRIGHT: (C)2003,JPO
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