| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To miniaturize a semiconductor device by reducing an inductance of a wiring conductor for a main current. <P>SOLUTION: A drain electrode wiring conductor 24 and a source electrode wiring conductor 25 are inserted into respectively different members, while the drain electrode wiring conductor 24 is inserted into a case 22 and the source electrode wiring conductor 25 is inserted into an upper member 20 fixed to the upper part of the case 22. The connecting part 25b of the source electrode wiring conductor 25 can be approximated to semiconductor elements 23a-23c by arranging the upper member 20 above the drain electrode wiring conductor 24. According to this method, a semiconductor module 21 can be miniaturized. <P>COPYRIGHT: (C)2003,JPO</p> |
