| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package for a high frequency and high output, which has small assembly errors and has little variations in high-frequency characteristics and has a high production yield. SOLUTION: The semiconductor package comprises a heat sink 1 to which a frame 5 is bonded and a control member 1a for controlling the flat movements of the frame 5, when bonding the frame 5 on the heat sink 1. COPYRIGHT: (C)2003,JPO |
