| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed-wiring board that has excellent reliability in an electric connection between a core hole and a surface hole and high efficiency in surface mounting, and to provide a method for manufacturing the multilayer printed-wiring board. SOLUTION: There are a process for forming a core hole 3 on a core board 5; a process for covering an opening of the core hole with a conductive film 21; a process for forming a film through hole 210 for entering a surface hole in the conductive film; a process for laminating a surface layer 6 onto the surface of the core board; a process for forming a surface hole 1 comprising a surface penetration section 1a and a film penetration section 1b that pass through the surface layer and the conductive film, and a deep recess 1c entering the inside of the core hole from the film penetration section by radiating the surface hole formation section of the surface layer 6 with laser; and a process for forming a metal-plated film 4 inside the surface hole. COPYRIGHT: (C)2003,JPO |
