发明名称 METHOD AND DEVICE FOR MOUNTING COMPONENTS
摘要 PROBLEM TO BE SOLVED: To provide a method for mounting components, which can eliminate defective products due to broken components and substrate, when the component sucked by a tool is pressed against the substrate and then ultrasonic vibration is applied to welding by metal diffusion. SOLUTION: A shift length obtained by recognizing the component sucked by the tool with a recognition means is decided in a step S6. When the shift length is smaller than the set reference value, subsequent mounting is executed in a step S7; and when it is not smaller than the set reference value, the subsequent mounting is stopped in a step S8. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003249523(A) 申请公布日期 2003.09.05
申请号 JP20020047245 申请日期 2002.02.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIYAZAKI HIROKUNI;TSUJISAWA TAKAFUMI;HIRATA SHUICHI
分类号 H01L21/60;H01L21/607;(IPC1-7):H01L21/60 主分类号 H01L21/60
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