| 摘要 |
PROBLEM TO BE SOLVED: To seal a semiconductor having a very small thickness by attaining superior heat resistance, water resistance, electrical insulation property, chemical resistance, and physical strength, and reducing the thickness after sealing. SOLUTION: A sealing member 3A obtained by coating an epoxy resin 32 that serves as an adhesive on a thin polyimide resin sheet 31, is laid over a semiconductor 2 which is mounted on a substrate 1, so that the whole surface of the semiconductor 2 is covered therewith, and that the side of the epoxy resin 32 faces the surface of the semiconductor 2. Thereafter, the epoxy resin 32 is softened by heating and pressing from the side of the polyimide resin sheet 31 and permitted to have appropriate viscosity and adherence. The epoxy resin 32, having viscosity and adherence, is then bonded to the semiconductor 2 and the substrate 1, thereby sealing the semiconductor 2, while allowing the softened resin material and the polyimide resin sheet 31 to cure after completion of the heat treatment. COPYRIGHT: (C)2003,JPO
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