| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot plate provided with a conductor pattern not blistering much with superior adhesion. SOLUTION: This hot plate 3 uses a ceramic nitride substrate 9 provided with the conductor pattern 10 and 10a. The conductor patterns 10 and 10a comprise bismuth or bismuth oxide, glass frit and noble metal grains. COPYRIGHT: (C)2003,JPO
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