PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE COVER LAY FILM

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition forming a cover lay film having flame retardance without using a halogen-containing flame retardant and to provide a photosensitive cover lay film.

SOLUTION: The photosensitive resin composition is prepared which comprises a soluble polyimide, a silicone compound having a branched structure and a (meth)acrylic compound as essential components, and by using the composition, the photosensitive cover lay film having improved flame retardance after curing can be provided without using a halogen compound.

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